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Picture Model No. Model No.2 Model No.3 Model No.4 Model No.5 Model No.6 Datasheet Order

ST

ST ST ST ST Qualcomn

ST62E01C

ST62T55 ST72561 STR712FR2 STM32L151V8 GT30L32S4W

ST62E01CF1

ST62T60 ST7260 STR712FR0 STM32L151RB GT31L16S2W80

ST62E01

ST62T53 ST72521B STR715FR0 STM32L151VB GT21L24S1W

ST62E10

ST62T62 ST7263B STR711FR2 STM32L151R8 GT24L16M1Y20

ST62E18

ST62T63 ST7265 STR712FR1 STM32L151CB GT20L24F6Y

ST62E18C

ST62T65 ST7267R8 STR711FR1 STM32L151C8 GT31L24M1W16

ST62E18CF1

ST62T80 ST7267C8 STR711FR0 STM32L152VB GT31L24M3W40

ST62E20

ST62T85 ST72681 STR710RZ STM32L152V8 GT22L16A1Y-S

ST62E20B

ST6200C ST72682 STR710FZ2 STM32L152RB GT22L16U1Y40

ST62E20C

ST6201C ST72C216 STR710FZ1 STM32L152R8 GT30L24T3Y

ST62E20CF1

ST6203C ST7LCRE4U1 STR736FV2 STM32L152CB GT20L16S1Y

ST62E25

ST6210C ST7LCRDIE6 STR736FV1 STM32L152C8 GT30L24M1W

ST62E25C

ST6220C ST7SCR1R4 STR736FV0 STM32W108HB GT30L24M1Z

ST62E25CF1

ST6225C ST7SCR1E4 STR735FZ2 STM32W108CB GT60L16M2K4

ST62E28CF1

ST6260C ST7GEME4 STR735FZ1 / GT32L24A180

ST62E28C6

ST6262C ST7LNB0V2Y0 STR731FV2 / GT21L16S2W

ST62E30B

ST6265C ST72F521 STR731FV1 / GT30L24A3W

ST62E30BF1

ST63E73 ST72F324L STR731FV0 / GT22L16A1Y-D

ST62E32BF1

ST7FOXF1 ST7LNB1Y0 STR730FZ2 / GT22L16V2Y-D

ST62E40BG1

ST7FOXK1 ST7MC1 STR730FZ1 / GT24L24A2Y

ST62E42BG1

ST7FOXK2 ST7MC2 STR912FAZ44 / GT32L32S0140

ST62E46BG1

ST7FOXA0 ST7DALIF2 STR912FAZ42 / GT21L16T1W

ST62E60B

ST7LITE0 ST7SUPERLITE STR912FAW44 / GT21L16S2Y

ST62E60C

ST7LITE2 ST10F271Z1 STR912FAW42 / GT23L16U2Y-D

ST62E62CF1

ST7LITE49K2 ST10F272Z2 STR911FAW44 / GT32L32M0180

ST62E62B

ST7LITE39F2 ST10F273Z4 STR911FAW42 / GT32L24M0140

ST62E62C

ST7LITE30F2 ST10F276Z5 STR911FAM44 / GT30L16M2Y

ST62E65B

ST7LITE35F2 ST10F168S STR911FAM42 / GT22L16M1Y-S

ST62E65C

ST7LITE49M ST10F269 STR910FAZ32 / GT32L24F0210

ST62E65CF1

ST7LITE1xB ST10F269Z1 STR910FAW32 / GT60M2

ST62E80B

ST7LITEU09 ST10F269Z2 STR910FAM32 / GT24U24A2Y

ST62E80BG1

ST7LITEU05 ST10R172L STR911FAM46 / GT20L16J1Y

ST62E85BG1

ST7LITEUS5 ST10R272L STR911FAM47 / GT22L16M1Y

ST62T00

ST7LITEUS2 ST10R167-Q STR911FAW46 / GT20L16P1Y

ST62T01

ST72260G STR750F: STR911FAW47 / GT32L32M4W40

ST62T03

ST72262G STR755FV2 STR912FAW46 / GT30L16U2W

ST62T08

ST72264G STR755FV1 STR912FAW47 / GT31L16M1Y80

ST62T09

ST72321 STR755FV0 STR912FAZ46 / GT22L24S3W-D

ST62T10

ST7232A STR755FR2 STR912FAZ47 / GT24L16A2Y

ST62T15

ST72321B STR755FR1 STR912FW44 / GT5SLAD2E-1A

ST62T18

ST72321M STR755FR0 STR912FW42 / GT8DL32S4W

ST62T20

ST72325 STR752FR2 STR911FM44 / GT8SL24K4W

ST62T25

ST72323 STR752FR1 STR911FM42 / GT5YL24A1Y200

ST62T28

ST72323L STR752FR0 STR910FW32 / GT5SL24K4W20

ST62T30

ST72340 STR751FR2 STR910FM32 / GT5DL24A2W96

ST62T32

ST72344 STR751FR1 STM32F100 / GT5SDL32A32

ST62T40

ST72345 STR751FR0 STM32F101 / GT30L32A1W

ST62T42

ST72324B STR750FV2 STM32F102 / GT24L16A1Y80

ST62T46

ST72324BL STR750FV1 STM32F103 / /

ST62T52

ST72361 STR750FV0 STM32F105 / /

IC


  • Integrated circuit (collectively referred to as semiconductor component products):


    Integrated circuit , abbreviated as IC; Or microcircuit, microchip, chip in electronics is a way to miniaturize circuits (mainly including semiconductor equipment, but also passive components, etc.), and is often manufactured on the surface of semiconductor wafers. microchip

    Introduction:

    After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors have been widely used to replace the functions and roles of vacuum tubes in circuits. By the middle and late 20th century, the progress of semiconductor manufacturing technology made integrated circuits possible. Compared with manually assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of microcrystalline tubes into a small chip, which is a great progress. The scale, production capacity, reliability and modular method of circuit design ensure the rapid adoption of standardized integrated circuits instead of discrete transistors.

    Integrated circuits have two main advantages over discrete transistors: cost and performance. The low cost is because the chip prints all components as a unit through photolithography technology, rather than making only one transistor at a time. The high performance is due to the fast switching of components, which consumes less energy because the components are small and close to each other. In 2006, the chip area ranged from a few square millimeters to 350 mm ², Per mm ² It can reach a million transistors.

    The first prototype of integrated circuit was completed by Jack Kilby in 1958. It includes a bipolar transistor, three resistors and a capacitor.

    According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

    Small scale integration (SSI) has less than 10 logic gates or less than 100 transistors.

    There are 11 ~ 100 medium scale integration logic gates or 101 ~ 1K transistors.

    There are 101 ~ 1K logic gates or 1001 ~ 10K transistors in large scale integration (LSI).

    Very large scale integration (VLSI) has 1001 ~ 10K logic gates or 10001 ~ 100k transistors.

    There are 10001 ~ 1m logic gates or 100001 ~ 10m transistors in ULSI.

    Glsi (full English Name: Giga scale integration) has more than 1000001 logic gates or more than 10000001 transistors.


    Classification of IC

    There are many classification methods of integrated circuits. According to whether the circuit belongs to analog or digital, it can be divided into analog integrated circuits, digital integrated circuits and mixed signal integrated circuits (analog and digital are on one chip).

    Digital integrated circuits can contain anything, from thousands to millions of logic gates, flip flops, multitasking and other circuits on a few square millimeters. The small size of these circuits enables higher speed, lower power consumption (see low power design) and lower manufacturing cost compared with board level integration. These digital ICs, represented by microprocessors, digital signal processors and microcontrollers, use binary to process 1 and 0 signals.

    Analog integrated circuits, such as sensors, power control circuits and operational amplifiers, process analog signals. Complete the functions of amplification, filtering, demodulation and mixing. By using analog integrated circuits with good characteristics designed by experts, the burden of circuit designers is reduced, and there is no need to design everything from the basic transistors.

    Integrated circuits can integrate analog and digital circuits on a single chip to make devices such as analog-to-digital converters and digital to analog converters. This circuit provides smaller size and lower cost, but care must be taken for signal collision.


    IC model

    The chip naming method is generally: letter + number + letter

    The first letter is the abbreviation of chip manufacturer or a chip family. For example, most of the MC starts with Motorola, and most of the max starts with Meixin.

    The number in the middle is the function model. Like mc7805 and lm7805, it can be seen from the 7805 that their function is to output 5V, but the manufacturers are different.

    The following letters are mostly packaging information. You can know what packaging the specific letters represent only by looking at the data provided by the manufacturer.

    74 series is the common name of standard TTL logic devices, such as 74ls00, 74ls02, etc. we can't see what company's products are from 74 alone. Different companies will prefix 74, such as sn74ls00.

    Related development semiconductor integrated circuits

    Generally, a complete IC model must include at least the following four parts:

    Prefix (initial) - many can speculate which company's products are.

    Device name -- generally, the function of the product can be inferred (its capacity can be known from memory).

    Temperature grade ---- distinguish commercial grade, industrial grade, military grade, etc. Generally, C represents civil grade, I represents industrial grade, e represents extended industrial grade, a represents aviation grade and M represents military grade.

    Package -- indicate the package and pin number of the product, and some IC models will have other contents:

    Rate -- for example, memory, MCU, DSP, FPGA and other products have rate differences, such as - 5 and - 6.

    Process structure -- for example, general digital IC has COMS and TL, which are commonly represented by letters C and t.

    Environmental protection - generally, there will be a letter at the end of the model to indicate whether it is environmental protection, such as Z, R, +, etc.

    Packaging - displays the packaging in which the material is transported, such as tube, t / R, rail, trail, etc.

    Version number - displays the number of modifications of the product. Generally, M is the first version.

    IC naming, packaging common sense and naming rules:


    Temperature range:

    C = 0 ℃ to 60 ℃ (commercial grade); I = - 20 ℃ to 85 ℃ (industrial grade); E = - 40 ℃ to 85 ℃ (extended industrial grade); A = - 40 ℃ to 82 ℃ (aviation grade); M = - 55 ℃ to 125 ℃ (military grade)

    Package type:

    A—SSOP; B—CERQUAD; C-to-200, TQFP; d-ceramic copper top; E—QSOP; F-ceramic SOP; H-sbgaj-ceramic dip; K—TO-3; L—LCC,M—MQFP; N -- narrow dip; n -- dip;; Q—PLCC; R - narrow ceramic dip (300mil); S—TO-52,T—TO5,TO-99,TO-100﹔U—TSSOP,uMAX,SOT; W-wide body small appearance (300mil); x-sc-60 (3P, 5p, 6p); y-narrow body copper top; Z—TO-92,MQUAD; D - bare sheet/ PR - enhanced plastic packaging; / W - wafer.

    Number of pins:

    A—8; B—10﹔C—12,192; D—14; E—16; F——22,256; G—4; H—4; I—28 ; J—2; K—5,68; L—40; M—6,48; N—18; O—42; P—20﹔Q—2,100﹔R—3,843; S——4,80; T—6,160; U—60; V-8 (round); W-10 (round); x-36; Y-8 (circular); Z-10 (circular).

    Note: if the first letter of the four letter suffix of interface products is e, it means that the device has anti-static function


    Development of IC Packaging Technology

    The earliest integrated circuits used ceramic flat packaging, which continued to be used by the military for many years because of reliability and small size. Commercial circuit packaging soon changed to dual in-line packaging, starting with ceramics and then plastics. In the 1980s, the pins of VLSI circuits exceeded the application limitations of dip packaging, and finally led to the emergence of pin grid array and chip carrier.

    Surface mount packaging appeared in the early 1980s and became popular in the late 1980s. It uses finer pin spacing, and the pin shape is seagull airfoil or J-type. Taking small outline integrated circuit (SOIC) as an example, it has 30-50% less area and 70% less thickness than the same dip. This package has seagull airfoil pins protruding on two long sides, with a pin spacing of 0.05 inches.

    Small outline integrated circuit (SOIC) and PLCC package. In the 1990s, although PGA packaging was still often used in high-end microprocessors. PQFP and thin small outline package (TSOP) become common packages for high pin count devices. The high-end microprocessors of Intel and AMD have changed from PGA (pine grid array) package to land grid array (LGA) package.

    Ball grid array packaging began to appear in the 1970s. In the 1990s, cladding ball grid array packaging with more pins than other packaging was developed. In the FCBGA package, the die is flipped up and down and connected to the solder ball on the package through a base layer similar to the PCB rather than a wire. FCBGA packaging makes the input and output signal array (called I / O area) distributed on the surface of the whole chip, rather than limited to the periphery of the chip. In today's market, packaging has become an independent part, and the packaging technology will also affect the quality and yield of products.

    FBelec has become the first-class agent of many international companies, obtaining the supply and inventory at a low price for the first time


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